As with Heavy Copper FR4 circuits it is sometimes preferable to produce a ceramic circuit with both control and power elements on one layer to save costs and packaging space. The Direct Plated Copper (DPC) manufacturing method is still relatively new in the field of Ceramic Substrate PCBs. DPC involves vacuum sputtering under high temperature and pressure conditions to plate the copper to the substrate. As well as allowing for plated through holes this production method makes it viable to have a layer with different copper thicknesses in selected areas thus allowing for a control section and a power section on the same layer.
Date : 08-12-2021
Daleba can manufacture PCBs ranging from single-sided to complex boards in excess of 40x layers. Our in-house CAM engineering resource allows us to rapidly check, panelise and commercially optimise a fast turnaround prototype as well as small volumes. We can supply simple technology boards in as little as 24 hours!
